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As academic social Q&A networking websites become more popular, scholars are increasingly using them to meet their information needs by asking academic questions. However, compared with other types of social media, scholars are less active on these sites, resulting in a lower response quantity for some questions. This paper explores the factors that help explain how to ask questions that generate more responses and examines the impact of different disciplines on response quantity.

The study examines 1,968 questions in five disciplines on the academic social Q&A platform ResearchGate Q&A and explores how the linguistic characteristics of these questions affect the number of responses. It uses a range of methods to statistically analyze the relationship between these linguistic characteristics and the number of responses, and conducts comparisons between disciplines.

The findings indicate that some linguistic characteristics, such as sadness, positive emotion and second-person pronouns, have a positive effect on response quantity; conversely, a high level of function words and first-person pronouns has a negative effect. However, the impacts of these linguistic characteristics vary across disciplines.

This study provides support for academic social Q&A platforms to assist scholars in asking richer questions that are likely to generate more answers across disciplines, thereby promoting improved academic communication among scholars.

The purpose of this paper is to investigate the effects of minor addition of the rare earth (RE) element cerium, Ce, on the microstructures and creep properties of Sn-Ag-Cu solder alloys.

The pure Sn, Sn-Cu alloy, Sn-Ag alloy and Cu-Ce alloy were used as raw materials. Sn-Ag-Cu alloys with different contents of RE Ce were chosen to compare with Sn-Ag-Cu. The raw materials of Sn, Sn-Cu alloy, Sn-Ag alloy, Cu-Ce alloy were melted in a ceramic crucible, and were melted at 550°C ± 1°C for 40 minutes. To homogenize the solder alloy, mechanical stirring was performed every ten minutes using a glass rod. During the melting, KC1 + LiCI (1.3:1), were used over the surface of liquid solder to prevent oxidation. The melted solder was chill cast into a rod.

It is found that the microstructure exhibits smaller grains and the Ag₃Sn/Cu₆Sn₅ intermetallic compound (IMC) phases are modified in matrix with the addition of Ce. In particular, the addition of 0.03 wt.% Ce to the Sn-Ag-Cu solder can refine the microstructures and decrease the thickness of the IMC layers of Sn-Ag-Cu solder alloys. Meanwhile, thermodynamic analysis showed that these phenomena could be attributed to the reduction of the driving force for Cu-Sn IMC formation due to the addition of Ce. Results calculated using the thermodynamic method are close to the above experimental data. Thus, the optimum content of Ce in Sn-Ag-Cu solder alloys should be about 0.030 percent. Additionally, the effect of Ce on the creep rupture life of Sn-Ag-Cu soldered joints was studied. It was found that the creep rupture life may be increased up to 7.5 times more than that of the original Sn-Ag-Cu alloy, when Ce accounts for 0.030 percent.

This paper usefully investigates the effects of the RE cerium (Ce), on the microstructures and creep properties of Sn-Ag-Cu solder alloys, optimizing the quantity of Ce in the Sn-Ag-Cu solder alloy through a thermodynamic method and by creep-rupture life testing.

The development of an effective corporate vision is a necessary issue for corporate performance, and it is a key issue for corporate sustainable development as well. The recognition of questions like “what is the role of corporate vision in corporate performance” is directly related to the attitude and practice of entrepreneurs and managers toward the development of corporate vision as well as the effectiveness of the corporate vision itself. To better answer the questions concerning the role of corporate vision development and effectively guide the practice of corporations, the authors study the pathways and mechanisms by which corporate visions operate to assist businesses in achieving high performance.

The article completes the construction of indicators to measure each dimension of the corporate vision in line with social cognitive theory and analyzes the relationship between corporate vision and corporate performance by combining qualitative comparative analysis (QCA) and necessary condition analysis (NCA) research methods. The article provides insights into the logic of constructing and adjusting corporate visions from a process perspective.

The mechanisms by which corporate visions can be articulated, accepted and transformed within the organization are also the means by which corporate visions can improve corporate performance. In a dynamic environment, the corporate vision setting and acceptance process integrates the requirements of various stakeholders, leading to the adjustment and acceptance of the corporate vision. As a result, the vision has continuous validity in a changing environment. Both start-ups and non-start-ups can benefit from the guidance provided by a strong corporate vision in overcoming a variety of issues and obstacles to produce strong business performance.

This is the first study that shows the relationship between corporate vision and corporate performance from a process perspective. The authors are interested in understanding which characteristics for building a corporate vision are more accepted by organizational members and, in turn, create high corporate performance. The authors also explore the conditions for corporate vision acceptance. This research has positive implications for shedding some light on the mechanisms by which corporate visions improve corporate performance.

The conventional design method relies on a priori knowledge, which limits the rapid and efficient development of electronic packaging structures. The purpose of this study is to propose a hybrid method of data-driven inverse design, which couples adaptive surrogate model technology with optimization algorithm to to enable an efficient and accurate inverse design of electronic packaging structures.

The multisurrogate accumulative local error-based ensemble forward prediction model is proposed to predict the performance properties of the packaging structure. As the forward prediction model is adaptive, it can identify respond to sensitive regions of design space and sample more design points in those regions, getting the trade-off between accuracy and computation resources. In addition, the forward prediction model uses the average ensemble method to mitigate the accuracy degradation caused by poor individual surrogate performance. The Particle Swarm Optimization algorithm is then coupled with the forward prediction model for the inverse design of the electronic packaging structure.

Benchmark testing demonstrated the superior approximate performance of the proposed ensemble model. Two engineering cases have shown that using the proposed method for inverse design has significant computational savings while ensuring design accuracy. In addition, the proposed method is capable of outputting multiple structure parameters according to the expected performance and can design the packaging structure based on its extreme performance.

Because of its data-driven nature, the inverse design method proposed also has potential applications in other scientific fields related to optimization and inverse design.

Surface mount technology (SMT) is widely used and plays an important role in electronic equipment. The purpose of this paper is to reveal the effects of interface cracks on the fatigue life of SMT solder joint under service load and to provide some valuable reference information for improving service reliability of SMT packages.

A 3D geometric model of SMT package is established. The mechanical properties of SMT solder joint under thermal cycling load and random vibration load were solved by 3D finite element analysis. The fatigue life of SMT solder joint under different loads can be calculated by using the modified Coffin–Manson model and high-cycle fatigue model.

The results revealed that cracks at different locations and propagation directions have different effect on the fatigue life of the SMT solder joint. From the location of the cracks, Crack 1 has the most significant impact on the thermal fatigue life of the solder joint. Under the same thermal cycling conditions, its life has decreased by 46.98%, followed by Crack 2, Crack 4 and Crack 3. On the other hand, under the same random vibration load, Crack 4 has the most significant impact on the solder joint fatigue life, reducing its life by 81.39%, followed by Crack 1, Crack 3 and Crack 2. From the crack propagation direction, with the increase of crack depth, the thermal fatigue life of the SMT solder joint decreases sharply at first and then continues to decline almost linearly. The random vibration fatigue life of the solder joint decreases continuously with the increase of crack depth. From the crack depth of 0.01 mm to 0.05 mm, the random vibration fatigue life decreases by 86.75%. When the crack width increases, the thermal and random vibration fatigue life of the solder joint decreases almost linearly.

This paper investigates the effects of interface cracks on the fatigue life and provides useful information on the reliability of SMT packages.

The averaged Navier‐Stokes and the k‐e turbulence model equations are used to simulate turbulent flows in some internal flow cases. The discrete equations are solved by different variations of Multigrid methods. These include both steady state as well as time dependent solvers. Locally refined grids can be added dynamically in all cases. The Multigrid schemes result in fast convergence rates, whereas local grid refinements allow improved accuracy with rational increase in problem size. The applications of the solver to a 3‐D (cold) furnace model and to the simulation of the flow in a wind tunnel past an object prove the efficiency of the Multigrid scheme with local grid refinement.

The purpose of this paper is to investigate the laser soldering of fine pitch quad flat package (QFP) devices using lead‐free solders and solder joint reliability during thermal cycling.

QFP devices were selected as the test vehicles and were soldered with four alloy types, Sn37Pb, Sn3.5Ag, Sn3.8Ag0.7Cu and Sn3.8Ag0.7Cu0.03Ce. The experimental samples were QFP‐256 devices with lead‐free solder paste on the printed circuit boards. The packages were dried for 24 h at 125°C prior to reflow soldering. Soldering experiments on the QFP devices were carried out with an infrared (IR) reflow soldering oven and a diode laser (DL) soldering system. Reflow soldering was performed at peak temperatures of 210°C (SnPb), 240°C (SnAgCu and SnAgCuCe) and 250°C (SnAg), as determined on the boards. Pull testing was adopted to evaluate the tensile strength of the four solders using an STR–1000 micro‐joint strength tester.

The tensile force of the QFP micro‐joints increased as laser intensity increased when it was less than an “optimal” value. The maximum tensile force of the QFP micro‐joints was gained when the laser intensity had increased to 2,165, 2,127, 2,165 and 2,064 W/cm², depending on the alloy used. The thermal fatigue performance of three lead‐free solder joints, SnAgCuCe, SnAgCu and SnAg, was determined to be superior to that of the eutectic SnPb alloy. After soldering without thermal cycling tests, the fracture morphology of soldered joints exhibited characteristic toughness fracture with both of the soldering methods. After 700 thermal cycles, the fracture mechanism was also toughness fracture, nevertheless, the dimples became large. The fracture morphology of the soldered joints subjected to 1,500 thermal cycles indicated brittle intergranular fracture on the fracture surface and no intense plastic deformation appeared before fracture with IR soldering. For DL soldering, the pull fracture model of the SnAgCuCe was completely ductile in the soldered joint with 1,500 thermal cycles.

The paper usefully investigates the influence of laser intensity on the tensile strength of different soldered joints and the solder joint reliability during thermal cycling.

The purpose of this paper is to understand different institutional mechanisms for promoting effective innovation diffusion and maximizing spillovers from fruitfulness of university‐industry linkages.

The approach involved the content analysis of university documents and in‐depth interviews with university personnel. The paper investigated the types of changes which had been instituted by selected universities in regards to the management of invention disclosure and patent licensing procedures, policies for new business startups by faculty and graduates. The paper then studies how university incentive structures have been reshaped to encourage and facilitate engagement with industry.

The types of changes have been instituted by select universities enhance research commercialization capacity in regards to the management of invention disclosure and patent licensing, policies for new business startups by faculty and graduates, and provision of seed capital, training and incubator facilities, especially the relationship between technology transfer offices and university administration, as well as faculty; how university incentive structure has been reshaped to encourage and facilitate engagement with industry; how gross royalties and/or net royalty income are distributed between university and faculty.

This paper describes the important role of institutional underpinnings for building commercial linkages. It also explores what university policies and institutions shape the nature and fruitfulness of innovation diffusion in China.

The purpose of this paper is to investigate the influence of praseodymium (Pr) additions (0, 0.05 and 0.5 wt%) on the mechanical properties and microstructure of SnAgCu solder joint during aging process. Moreover, the authors aim to indicate that the decreased soldification undercooling of Sn3.8Ag0.7Cu solder can suppress the formation of Ag3Sn plate to some extent.

The shear strength evolution of SAC, SAC‐0.05Pr and SAC‐0.5Pr solder joint were studied under 150°C aging process with STR‐1000. The effect of Pr additions on the solidification behavior of SnAgCu solder was also studied by differential scanning calorimetry. To study the microstructure evolution, the cross‐sections of all specimens were observed by means of scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS). Meanwhile, the etchant, consisting of 20%HNO3+distilled water was used for deep etching to reveal the interfacial morphology.

The shear force reduction rate of SAC solder joint during aging was restrained by 0.05%Pr addition but promoted with 0.5% Pr addition. The growth of IMC layer of SnAgCu joint in the aging process was suppressed significantly by different amounts of Pr additions. However, the beneficial effect of Pr addition due to the suppression of IMC layer growth was weakened by the micro‐cracks formed in PrSn3 compounds in SnAgCu‐0.5Pr joint. Pr additions (0.05, 0.5 wt%) decrease the solidification undercooling of SnAgCu solder, which will suppress the formation of Ag3Sn plate to some extent.

Further studies are necessary for confirmation of the practical application, especially of the manufacturing technology of solder paste containing Pr.

The appropriate amount of Pr in Sn3.8Ag0.7Cu solder is about 0.05 wt%. It is found that SAC‐0.05Pr solder has an improvement in solder joint reliability in long aging processes. The results suggested the novel solder alloys can meet the requirements of high reliability application.

The paper demonstrates that: Pr additions promote the solidification of SAC solder; shear force reduction rate of SAC solder joint was reduced by 0.05%Pr addition; the IMC layer growth rate of SnAgCu solder joint was suppressed by Pr additions; and micro‐cracks were found in PrSn3 phases after aging.